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PCB Manufacturing Capabilities
Linear Electronics is a full service, high-mix, high complexity, mid to low volume global Electronics Manufacturing Services (EMS) and Custom Material Solutions (CMS) company, providing complete end-to-end supply chain management solutions in electronic and mechanical products for Original Equipment Manufacturers (OEMs).
PCB Manufacturing Capabilities::
Items | Mass | Sample | |
Layers | 2~68L | 120L | |
Max. Board Thickness | 10mm(394mil) | 14mm(551mil) | |
Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
Registration | Same Core | ±25um | ±20um |
Layer to Layer | ±5mil | ±4mil | |
Max. Copper Thickness | 6Oz | 30Oz | |
Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
Laser | 0.1mm(4mil) | 0.050mm(2mil) | |
Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX600mm |
Backplane | 1250mmX570mm | 1320mmX600mm | |
Aspect Ratio (Finish Hole) | Line-card | 20:1 | 28:1 |
Backplane | 25:1 | 35:1 | |
Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
Surface Finish | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG |